top of page
circuit-datacenter.jpg

Technical Presentations 

Kees Propstra.png

Kees Propstra

Vice President of Marketing and General Manager of Quantifi Photonics 

Challenges + Strategies for high volume
manufacturing and testing of Co-Packaged Optics

Co-Packaged Optics (CPO) promise significant density, power, and thermal advantages for next gen AI/ML systems and data center switches compared with current transceiver assemblies. But how can CPO systems be assembled in high-volume? What test and measurement approaches will be needed to ensure spec compliant operation.

quantifi-presentation-thumb.png
Tortsen Vahrenkamp.png

Manufacturing Made Light - Solutions for Integrated Photonics - Built to Scale 

Torsten Vahrenkamp, CEO and co-founder of ficonTEC GmbH

ficontec-pres-thumb.png

Exploring Optical Connectors and Fibers
for Next-Gen Switch Fiber Technology

ofs-presentation.png
panduit-presentation.png
jeff-mackey.jpg

Data Center Front-Panel and Embedded I/O

Data Center Front-Panel and Embedded I/O

Jeffery Maki

Juniper Networks,
Distinguished Engineer II

jeff-makey-presentatin-sm.jpg
logo-juniper.jpg
Yuval-Shay.jpg

Data Center Front-Panel and Embedded I/O

Yuval Shay

Director of Product
Management & Marketing
Synopsys

synopsis-logo.png
synopsys-presentation-sm.jpg
MMWG-presentation-thumbnail.png

MWIS - Multimode Waveguide Interconnect System

hirose-logo-title.jpg
Unknown_edited.jpg

Joshua Kihong Kim 

Principal Engineer

Signal Integrity in Photonics

microsoft-azure.png
800G-race.png

Next-Gen Data Center Interconnects:
The Race to 800G

Inphi Race to 800G - Next-Gen Data Center

inphi-pres.png
radha_nagarajan.jpg

Dr. Radha Nagarajan

Chief Technical Officer
and Senior Vice
President, Platforms

logo-inphi.png
ilya-pic.png

Dr. Ilya Lyubomirsky

Senior Technical Director, Systems/DSP Architectures

logo-inphi.png
SABIC-title.png
sabic-logo.png

Thermoplastic Optical Integration
into Co-Packaged Applications

Peter Johnson is a Staff Scientist and SABIC, supporting the development of new chemistries and blends in polyetherimide resins . He obtained his Ph.D in Chemistry at the University of Colorado, Boulder, and has over 10 years of experience in the plastics industry.

 

For over 20 years, ULTEM™ and EXTEM™ resins from SABIC Specialties have often been specified in the IR transparent optoelectronic interface and fiber optic connectors. Today, demands for vastly increased bandwidth are posing new engineering challenges for the design and production of highly complex, cost effective components within a shrinking connector footprint.

 

As light coupling optics move from pluggables to on-board or co-packaged designs, new chemistry and materials are expected to meet the changing application environment.  The impact to design flexibility, material selection requirements, and assembly steps will be presented, along with potential technology solutions from SABIC Specialties designed to address these challenges.

peter-johnson.png

Peter Johnson
Staff Scientist,
SABIC Specialties

global-foundries.png

GLOBALFOUNDRIES
Silicon Photonics

global-foundries-logo.png
vikas-gupta.jpeg

Vikas Gupta, 
Senior Director of Product
Management and Marketing

IBM-PPT-Title.png
ibm-logo.jpg

Efficient Manufacturing for Silicon Photonics and Co-Packaged Optics 

Optics is a ground field for Alexander, starting in the dot-com era, with his first internship at JDS Uniphase designing AWG for DWDM.  He received a B.Eng. degree in engineering physics with mention of excellence from the Ecole Polytechnique de Montreal, with a specialization in numerical simulation for solid state physics and laser matter interaction.

 

In his computer simulation and imaging master’s degree, he created a real-time STM image predictor to understand the complex convolution of electronic states in tunneling current measurement. He then worked in speech recognition at Speeckworks with Hidden Markov Model and Neural Networks algorithms. 

 

Joining IBM in 2007, Alexander tackle advanced packaging development within the C2MI research center (www.c2mi.ca) with focus on optoelectronics and semiconductor co-packaging and in 2012, he moved to the silicon nanophotonics team to help lead optical characterization and packaging development.  

Moi2.jpg

Alexander Janta-Polczynski
Senior Advanced Packaging Engineer

bottom of page