Technical Presentations | Advanced Photonics Coalition

Member Presentations

Kees Propstra

Vice President of Marketing and General Manager of Quantifi Photonics

Challenges + Strategies for high volume
manufacturing and testing of Co-Packaged Optics

Co-Packaged Optics (CPO) promise significant density, power, and thermal advantages for next gen AI/ML systems and data center switches compared with current transceiver assemblies. But how can CPO systems be assembled in high-volume? What test and measurement approaches will be needed to ensure spec compliant operation.

Manufacturing Made Light - Solutions for Integrated Photonics - Built to Scale

Torsten Vahrenkamp, CEO and co-founder of ficonTEC GmbH

Paul Yip
Product Marketing Manager

Teruhiko Omori
at Fujikura

New fiber connectivity options inside the switch chassis

As the next generation of data center switch designs advance, new possibilities for fiber management inside the chassis are emerging.From the recent webinar Paul Yip discussed an innovative fiber shuffle from Optec for transmitting optical signals from the switching silicon to the front panel. The idea is to facilitate the fiber management and system redundancy from the CPO optical engines.

Teruhiko Omori at Fujikura presented the next-gen VSFF multi-fiber connector with standard and reduced clad fibers suitable for these applications. Backward & forward compatibilities, intermateability, reliability, and installation & maintenance issues are considered.

DOWNLOAD PRESENTATION

Exploring Optical Connectors and Fibers
for Next-Gen Switch Fiber Technology

Data Center Front-Panel and Embedded I/O

Jeffery Maki, Distinguished Engineer at Juniper Networks discussing the possibilities for integrated lasers in pluggable, co-packaged or on-board optics in data center applications.

Jeffery Maki

Juniper Networks,
Distinguished Engineer II

Introducing OpenLight

Driving The Next Era of Open Silicon Photonics with Integrated Lasers

A presentation from OpenLight, the newly formed joint venture company between Juniper and Synopsys that is working with Tower Semiconductor to bring this technology to market on a scalable platform.

Data Center Front-Panel and Embedded I/O

Yuval Shay

Director of Product
Management & Marketing
Synopsys

New Design Considerations for a CPO or OBO Switch

A detailed 46-page industry guidance document addressing the design options ahead for a Co-Packaged or On-Board Optics Switch.

Scaling into the Next Decade

Broadcom presentation of Scaling into the Next Decade discussesing the potential for SiPh Chiplets In Package (SCIP) optical engines for driving next-generation data center connectivity.

CPO Optical Connectivity
Considerations

Presentation - US Conec, a supplier of connector embodiment packages based on standardized and custom optical interconnect ferrules.

MWIS - Multimode Waveguide Interconnect System

A new Interconnect System in Motion

Advanced PCBs with Optical Waveguide Interconnects

Introduction to Multimode Waveguide
(MMWG) Interconnect Systems for Photonic Integrated Circuits

Optics is Easy

Description: Brad Booth discusses Azure Hardware & Architecture

3M-Rosenberger COBO Webinar

The Application of Expanded Beam Optics in the Next Generation of Data Centers

The Evolution of Data Center Networks

Amit Sanyal is VP of Marketing at Innovium. He has over 20 years of marketing and engineering leadership experience in data center infrastructure. Previously Amit was an Executive Director at Dell. During his 5 year tenure at Dell, he drove networking solutions for the data center. Amit also spent over 11 years at Cisco, managing marketing & product management teams in routing, switching and servers. Earlier in his career, he was an engineering lead at Sun Microsystems. He holds an MBA from The Wharton School and a BS in Computer Science & Engineering from Indian Institute of Technology, Delhi.

Amit Sanyal

VP of Marketing

Hugh Durdan
VP of Marketing,

Hugh Durdan serves as Inphi’s Vice President Marketing, Networking Interconnect. He joined Inphi after the company acquired eSilicon in 2020. At eSilicon, Hugh held the role of Vice President, Strategy and Products responsible for ASIC and IP marketing and PHY development. Prior to eSilicon, Hugh was Vice President, Design IP Marketing at Cadence Design Systems and previously held various leadership roles at Xilinx, Altera, LSI Logic and Digital Equipment Corp. Hugh serves on the Advisory Board for eBeam Initiative. He holds a B.S. degree in Computer and Systems Engineering from Rensselaer Polytechnic Institute.

Next-Gen Data Center Interconnects:
The Race to 800G

Inphi Race to 800G - Next-Gen Data Center

Dr. Nagarajan brings more than 20 years of experience in the area of high-speed optical interconnects and design, development and commercialization of large-scale photonic integrated circuits. Dr. Nagarajan is a Fellow of the IEEE, OSA and IET (UK). In 2006, he shared the IEEE/LEOS Aron Kressel Award for his work on commercializing large-scale photonic integrated circuits. He has been awarded more than 195 US patents. He received his B.Eng. from the National University of Singapore, M.Eng. from the University of Tokyo, and Ph.D. from the UC, Santa Barbara.

Dr. Radha Nagarajan

Chief Technical Officer
and Senior Vice
President, Platforms

Dr. Ilya Lyubomirsky

Senior Technical Director, Systems/DSP Architectures

Dr. Ilya Lyubomirsky joined Inphi in 2017 as a Distinguished Engineer to work on coherent DSP for 400G ZR. Currently, Ilya is a Senior Technical Director, leading the Systems/DSP Architecture team on the research and development of 400G/800G PAM4 DSP ASICs. Dr. Lyubomirsky brings more than 20 years of experience in the areas of digital communications, signal processing, DWDM systems, and data center interconnects. Prior to Inphi, Ilya led the engineering team on Facebook’s Voyager project, successfully demonstrating the world’s first 800 Gb/s DWDM white box coherent transponder. Prior to that, Dr. Lyubomirsky held various engineering and academic roles at Finisar, Infinera, University of California, Ciena and Telcordia. During his career in industry and academia, Ilya has contributed extensively to IEEE 802.3 Ethernet standards, has authored or co-authored more than 50 peer-reviewed journal and conference papers, and is an inventor or co-inventor on 15 patents. Dr. Lyubomirsky received dual B.S. degrees in Electrical Engineering and Mathematics at University of Maryland in 1991, and his M.S. and Ph.D. degrees in Electrical Engineering from Massachusetts Institute of Technology in 1994 and 1999, respectively.

Advanced Material Solutions
for Co-Packaged Optics

Dr. Jake Joo is a R&D leader in Emerging Technologies, Electronics & Imaging, DuPont. He leads Optoelectronics group ranging from high speed photonic data center, optical sensors, and novel displays. He holds Ph.D. from Materials Science and Engineering at Massachusetts Institute of Technology and has more than fifteen years research and management experience involving nanomaterials with multidisciplinary teams including industry, university, and license partners. Dr. Joo is an inventor of 11 issued US patents with 17 patent applications pending in electronic markets including photonic integration material/design, quantum dot display, touch screen device, and printed electronics.

Jake Joo

R&D Leader, Emerging Technologies, Electronics & Imaging

Thermoplastic Optical Integration
into Co-Packaged Applications

Peter Johnson is a Staff Scientist and SABIC, supporting the development of new chemistries and blends in polyetherimide resins . He obtained his Ph.D in Chemistry at the University of Colorado, Boulder, and has over 10 years of experience in the plastics industry.

For over 20 years, ULTEM™ and EXTEM™ resins from SABIC Specialties have often been specified in the IR transparent optoelectronic interface and fiber optic connectors. Today, demands for vastly increased bandwidth are posing new engineering challenges for the design and production of highly complex, cost effective components within a shrinking connector footprint.

As light coupling optics move from pluggables to on-board or co-packaged designs, new chemistry and materials are expected to meet the changing application environment. The impact to design flexibility, material selection requirements, and assembly steps will be presented, along with potential technology solutions from SABIC Specialties designed to address these challenges.

Peter Johnson
Staff Scientist,
SABIC Specialties

GLOBALFOUNDRIES
Silicon Photonics

Vikas Gupta,
Senior Director of Product
Management and Marketing

Efficient Manufacturing for Silicon Photonics and Co-Packaged Optics

Optics is a ground field for Alexander, starting in the dot-com era, with his first internship at JDS Uniphase designing AWG for DWDM. He received a B.Eng. degree in engineering physics with mention of excellence from the Ecole Polytechnique de Montreal, with a specialization in numerical simulation for solid state physics and laser matter interaction.

In his computer simulation and imaging master’s degree, he created a real-time STM image predictor to understand the complex convolution of electronic states in tunneling current measurement. He then worked in speech recognition at Speeckworks with Hidden Markov Model and Neural Networks algorithms.

Joining IBM in 2007, Alexander tackle advanced packaging development within the C2MI research center (www.c2mi.ca) with focus on optoelectronics and semiconductor co-packaging and in 2012, he moved to the silicon nanophotonics team to help lead optical characterization and packaging development.

Alexander Janta-Polczynski
Senior Advanced Packaging Engineer

Member Presentations

Challenges + Strategies for high volume manufacturing and testing of Co-Packaged Optics

New fiber connectivity options inside the switch chassis

Exploring Optical Connectors and Fibers for Next-Gen Switch Fiber Technology

Data Center Front-Panel and Embedded I/O

Data Center Front-Panel and Embedded I/O

Introducing OpenLight

Driving The Next Era of Open Silicon Photonics with Integrated Lasers

Data Center Front-Panel and Embedded I/O

New Design Considerations for a CPO or OBO Switch

Scaling into the Next Decade

CPO Optical Connectivity Considerations

MWIS - Multimode Waveguide Interconnect System

Advanced PCBs with Optical Waveguide Interconnects

Optics is Easy

3M-Rosenberger COBO Webinar

The Evolution of Data Center Networks

Next-Gen Data Center Interconnects: The Race to 800G

Inphi Race to 800G - Next-Gen Data Center

Advanced Material Solutions for Co-Packaged Optics

Thermoplastic Optical Integration into Co-Packaged Applications

GLOBALFOUNDRIES Silicon Photonics

Efficient Manufacturing for Silicon Photonics and Co-Packaged Optics

Challenges + Strategies for high volume
manufacturing and testing of Co-Packaged Optics

Exploring Optical Connectors and Fibers
for Next-Gen Switch Fiber Technology

CPO Optical Connectivity
Considerations

Next-Gen Data Center Interconnects:
The Race to 800G

Advanced Material Solutions
for Co-Packaged Optics

Thermoplastic Optical Integration
into Co-Packaged Applications

GLOBALFOUNDRIES
Silicon Photonics