Vice President of Marketing and General Manager of Quantifi Photonics
Challenges + Strategies for high volume
manufacturing and testing of Co-Packaged Optics
Co-Packaged Optics (CPO) promise significant density, power, and thermal advantages for next gen AI/ML systems and data center switches compared with current transceiver assemblies. But how can CPO systems be assembled in high-volume? What test and measurement approaches will be needed to ensure spec compliant operation.
Manufacturing Made Light - Solutions for Integrated Photonics - Built to Scale
Torsten Vahrenkamp, CEO and co-founder of ficonTEC GmbH
Product Marketing Manager
New fiber connectivity options inside the switch chassis
As the next generation of data center switch designs advance, new possibilities for fiber management inside the chassis are emerging.From the recent webinar Paul Yip discussed an innovative fiber shuffle from Optec for transmitting optical signals from the switching silicon to the front panel. The idea is to facilitate the fiber management and system redundancy from the CPO optical engines.
Teruhiko Omori at Fujikura presented the next-gen VSFF multi-fiber connector with standard and reduced clad fibers suitable for these applications. Backward & forward compatibilities, intermateability, reliability, and installation & maintenance issues are considered.
Data Center Front-Panel and Embedded I/O
Data Center Front-Panel and Embedded I/O
Distinguished Engineer II
Driving The Next Era of Open Silicon Photonics with Integrated Lasers
New Design Considerations for a CPO or OBO Switch
CPO Optical Connectivity
Advanced PCBs with Optical Waveguide Interconnects
3M-Rosenberger COBO Webinar
The Evolution of Data Center Networks
Amit Sanyal is VP of Marketing at Innovium. He has over 20 years of marketing and engineering leadership experience in data center infrastructure. Previously Amit was an Executive Director at Dell. During his 5 year tenure at Dell, he drove networking solutions for the data center. Amit also spent over 11 years at Cisco, managing marketing & product management teams in routing, switching and servers. Earlier in his career, he was an engineering lead at Sun Microsystems. He holds an MBA from The Wharton School and a BS in Computer Science & Engineering from Indian Institute of Technology, Delhi.
Hugh Durdan serves as Inphi’s Vice President Marketing, Networking Interconnect. He joined Inphi after the company acquired eSilicon in 2020. At eSilicon, Hugh held the role of Vice President, Strategy and Products responsible for ASIC and IP marketing and PHY development. Prior to eSilicon, Hugh was Vice President, Design IP Marketing at Cadence Design Systems and previously held various leadership roles at Xilinx, Altera, LSI Logic and Digital Equipment Corp. Hugh serves on the Advisory Board for eBeam Initiative. He holds a B.S. degree in Computer and Systems Engineering from Rensselaer Polytechnic Institute.
Inphi Race to 800G - Next-Gen Data Center
Dr. Nagarajan brings more than 20 years of experience in the area of high-speed optical interconnects and design, development and commercialization of large-scale photonic integrated circuits. Dr. Nagarajan is a Fellow of the IEEE, OSA and IET (UK). In 2006, he shared the IEEE/LEOS Aron Kressel Award for his work on commercializing large-scale photonic integrated circuits. He has been awarded more than 195 US patents. He received his B.Eng. from the National University of Singapore, M.Eng. from the University of Tokyo, and Ph.D. from the UC, Santa Barbara.
Dr. Radha Nagarajan
Chief Technical Officer
and Senior Vice
Senior Technical Director, Systems/DSP Architectures
Dr. Ilya Lyubomirsky joined Inphi in 2017 as a Distinguished Engineer to work on coherent DSP for 400G ZR. Currently, Ilya is a Senior Technical Director, leading the Systems/DSP Architecture team on the research and development of 400G/800G PAM4 DSP ASICs. Dr. Lyubomirsky brings more than 20 years of experience in the areas of digital communications, signal processing, DWDM systems, and data center interconnects. Prior to Inphi, Ilya led the engineering team on Facebook’s Voyager project, successfully demonstrating the world’s first 800 Gb/s DWDM white box coherent transponder. Prior to that, Dr. Lyubomirsky held various engineering and academic roles at Finisar, Infinera, University of California, Ciena and Telcordia. During his career in industry and academia, Ilya has contributed extensively to IEEE 802.3 Ethernet standards, has authored or co-authored more than 50 peer-reviewed journal and conference papers, and is an inventor or co-inventor on 15 patents. Dr. Lyubomirsky received dual B.S. degrees in Electrical Engineering and Mathematics at University of Maryland in 1991, and his M.S. and Ph.D. degrees in Electrical Engineering from Massachusetts Institute of Technology in 1994 and 1999, respectively.
Advanced Material Solutions
for Co-Packaged Optics
Dr. Jake Joo is a R&D leader in Emerging Technologies, Electronics & Imaging, DuPont. He leads Optoelectronics group ranging from high speed photonic data center, optical sensors, and novel displays. He holds Ph.D. from Materials Science and Engineering at Massachusetts Institute of Technology and has more than fifteen years research and management experience involving nanomaterials with multidisciplinary teams including industry, university, and license partners. Dr. Joo is an inventor of 11 issued US patents with 17 patent applications pending in electronic markets including photonic integration material/design, quantum dot display, touch screen device, and printed electronics.
R&D Leader, Emerging Technologies, Electronics & Imaging
Thermoplastic Optical Integration
into Co-Packaged Applications
Peter Johnson is a Staff Scientist and SABIC, supporting the development of new chemistries and blends in polyetherimide resins . He obtained his Ph.D in Chemistry at the University of Colorado, Boulder, and has over 10 years of experience in the plastics industry.
For over 20 years, ULTEM™ and EXTEM™ resins from SABIC Specialties have often been specified in the IR transparent optoelectronic interface and fiber optic connectors. Today, demands for vastly increased bandwidth are posing new engineering challenges for the design and production of highly complex, cost effective components within a shrinking connector footprint.
As light coupling optics move from pluggables to on-board or co-packaged designs, new chemistry and materials are expected to meet the changing application environment. The impact to design flexibility, material selection requirements, and assembly steps will be presented, along with potential technology solutions from SABIC Specialties designed to address these challenges.
Senior Director of Product
Management and Marketing
Efficient Manufacturing for Silicon Photonics and Co-Packaged Optics
Optics is a ground field for Alexander, starting in the dot-com era, with his first internship at JDS Uniphase designing AWG for DWDM. He received a B.Eng. degree in engineering physics with mention of excellence from the Ecole Polytechnique de Montreal, with a specialization in numerical simulation for solid state physics and laser matter interaction.
In his computer simulation and imaging master’s degree, he created a real-time STM image predictor to understand the complex convolution of electronic states in tunneling current measurement. He then worked in speech recognition at Speeckworks with Hidden Markov Model and Neural Networks algorithms.
Joining IBM in 2007, Alexander tackle advanced packaging development within the C2MI research center (www.c2mi.ca) with focus on optoelectronics and semiconductor co-packaging and in 2012, he moved to the silicon nanophotonics team to help lead optical characterization and packaging development.
Senior Advanced Packaging Engineer