


Co-Packaged Optics
Over the past decade, the capacity of data center Ethernet switches has surged to 25.6 Tbps, driven by the adoption of 64x 400 Gbps or 32x 800 Gbps pluggable optical transceiver modules. However, these high-speed modules pose significant challenges. Issues include the required densities of electrical and optical connectors, as well as escalating power consumption.
The concept behind CPO-based systems designs is to remove the Optics/Lasers (i.e. transceiver functionality) from the front faceplate of the switch and place it right next to the switch ASIC.
The main advantages of a CPO-based switch design are:
1) power savings
2) latency reduction
3) higher switch bandwidth density.
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The focus of the Co-Packaged Optics Working Group is currently being defined. Some of the initial standards focus has been on:
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Lasers will be built into every ASIC chip and fibers or optical waveguides will carry the signal between chips.
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Thermally decouple the ASIC from the transceiver
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There are no currently standards for NPO
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Main target is data centers and HPC environments
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Ecosystem Standards Goals:
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Reduce the amount of power necessary for data centers and HPCs
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Demonstrate solutions utilizing the current model of ecosystem (stand alone components assembled by OSATs)
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Drive cohesiveness within the industry to create adoption of standards​ for lower volume manufacturing