Announcing Advanced Photonics Coalition [www.advanced-photonics.org]

Artificial Intelligence is driving a surge in demand for next-generation optical interconnects, with photonic integrated circuits (PICs) poised to revolutionize the data infrastructure crucial for AI and high-speed optical networks. These technologies are essential for scaling data transmission and reducing energy consumption, making them ideal for high-channel-count, high-density optical interconnects. However, they come with unique challenges that must be addressed to fully realize their potential. This panel provides valuable perspectives on the collaboration, innovations and methodologies driving robust high-volume PIC production. Hear from industry leaders across the photonics ecosystem as they discuss the challenges of manufacturing PIC technologies and what it will take to finally scale up to high volumes. Speakers include experts in photonics development, foundries, OSAT, contract manufacturing, assembly/alignment equipment, test and measurement and industry standards.

Vikas Gupta, GlobalFoundries Noam Ophir, Jabil Manish Mehta, Broadcom Torsten Varenkamp, Ficontec Dhiraj Bors, Silitronics Kees Propstra, Quantifi Photonics Jose Pozo, Optica Jeff Maki, Advanced Photonics Coalition

Co-Packaged Optics (CPO) promises significant density, power, and thermal advantages for next gen AI/ML systems and data center switches compared with current transceiver assemblies. But how can CPO systems be assembled in high-volume? What test and measurement approaches will be needed to ensure spec compliant operation. In this one-hour webcast we will hear from Torsten Vahrenkamp, CEO and co-founder of ficonTEC GmbH and Kees Propstra, VP of Marketing & GM Quantifi Photonics USA Inc.

As the next generation of data center switch designs advance, new possibilities for fiber management inside the chassis are emerging. In this one-hour webinar, we will hear from Paul Yip who will discuss an innovative fiber shuffle from Optec for transmitting optical signals from the switching silicon to the front panel. The idea is to facilitate the fiber management and system redundancy from the CPO optical engines. Then we will hear from Teruhiko Omori at Fujikura who will present the next-gen VSFF multi-fiber connector with standard and reduced clad fibers suitable for these applications. Backward & forward compatibilities, intermateability, reliability, and installation & maintenance issues are considered.

The prospect of integrating lasers monolithically on a chip has been discussed for a while. New fabrication techniques and market entrants signify that we are entering a New Era for Integrated Lasers. In this one-hour webinar, you will hear from Jeffery Maki, Distinguished Engineer at Juniper Networks and Treasurer of the Consortium for Onboard Optics, discussing the possibilities for integrated lasers in pluggable, co-packaged or on-board optics in data center applications. His introduction will be followed by a presentation from Tom Mader, COO of OpenLight, the newly formed company that is working with Tower Semiconductor to bring this technology to market on a scalable platform. Finally, you will hear from Yuval Shay, Director of Product Marketing at Synopsys, who will discuss the toolsets and design methodologies available for developing your applications.

Next generation applications within datacenters continue their trend toward data intensive usage models and resource disaggregation. To meet the next generation application requirements, cost, power, latency, and overall bandwidth of each component needs to be considered for both existing applications and new use cases. The removal of the optical pluggables from the faceplate provides an opportunity to re-evaluate the faceplate design configuration for optical connections, heat management, and power into a network switch or datacenter server. In July 2022, the Consortium for On-board Optics (COBO) will publish a detailed 47-page white paper addressing the design options ahead for a Co-Packaged or On-Board Optics Switch. The white paper represents the work of 47 companies and took 2 years to write, covers Our hour-long webinar will discuss key finding, including these designs options and their potential impacts on optical signal, thermal, and safety criteria.

With the first generation of 51.2T switches running at 100 Gbps per lane on the horizon, the market will be considering the pros and cons of different board design choices for managing so many high capacity channels. Will co-packaged optics (CPO) or near-packaged optics (NPO) scale to meet the bandwidth density challenge? Dr. Rebecca K. Schaevitz, COBO Board Member and Principal Engineer/Product Line Manager at Broadcom, will discuss the the potential for SiPh Chiplets In Package (SCIP) optical engines for driving next-generation data center connectivity. Tom Mitcheltree, Advanced Technology Manager for US Conec, discusses connector embodiment packages based on standardized and custom optical interconnect ferrules.