Optica + APC Photonic-Enabled Cloud Computing (PECC) Industry Summit - The Premier Annual Event for Leaders in Data Center Technologies

 

Optica is partnering with the Advanced Photonics Coalition (APC) to host the PECC Industry Summit. This summit will focus on bringing companies together in the supply chain to discuss the innovations and deployment of optics in data center applications and beyond.  Join us at the Juniper Networks Aspiration Dome in Sunnyvale, California.

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During this confidential in-person gathering, we will delve into these critical topics:

 

Enhancements in speed and bandwidth for next-generation AI workloads: To meet the growing demands of next-generation AI, the photonics and semiconductor industries are advancing co-packaged optics, chiplet-based architectures, and high-speed optical interconnects to overcome I/O and energy bottlenecks. We’ll explore the latest in pluggable transceivers that integrate with today’s data centers while paving the way for co-packaged solutions. Hear from industry leaders driving the shift from copper to light-based technologies to transform AI data movement and processing.

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Advancements in lowering AI Energy Consumption: As AI workloads grow, so do their energy demands—making efficiency a top priority for global data centers. NVIDIA is pioneering the use of silicon photonics in its switches, and returning keynote Ashkan Seyedi, Director of Networking, will share his go-to-market strategy for cutting-edge optical interconnects. By shifting from traditional pluggables to co-packaged optics (CPO), power consumption can be reduced significantly.

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Optimizing Light Engines for Reduced Power Consumption in AI: As AI models scale, efficient optical interconnects are essential to manage power demands. Optimizing light engines—by integrating low-power lasers, advanced multiplexing, and compact packaging—reduces energy per bit while maintaining high bandwidth. These innovations are key to enabling scalable, sustainable AI infrastructure, particularly in data centers moving toward co-packaged optics and chiplet-based systems.

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New Materials and Their Impact: Emerging electro-optic materials are reshaping the future of high-speed, low-power data movement. Innovations such as Thin-Film Lithium Niobate (TFLN), Barium Titanate (BTO), Electro-Optic polymers and organics, and plasmonics are driving advances in bandwidth, modulation speed, and energy efficiency. We’ll explore how these materials, combined with chiplet-based architectures, are unlocking new performance frontiers in next-generation optical interconnects.

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Key Highlights:

• Networking: Connect with industry leaders and forge new partnerships.

• Knowledge Sharing: Dive into the latest advancements in cloud computing.

• Ecosystem Engagement: Collaborate with subject matter experts, supply chain partners, and end-users to tackle industry challenges.

 

Contact:
For details contact Dr. Jon Pugh at jpugh@optica.org or Melissa Kallos at mk@advanced-photonics.org.

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Don’t miss this opportunity to shape the future of cloud computing!